YIELDGUARD · FAB YIELD COPILOT
Every failed die, explained.
From the probe tester to a root cause, with every claim checked against what the models actually returned.
01 · OFF THE LINE
A lot leaves etch.
The wafers ran on the etch line and are heading into wafer sort. At this point nobody knows which dies work.
02 · PROBE TESTER
Every die is tested.
Probes touch each die and test it electrically. Green passed, red failed. That map is what YieldGuard classifies: a measurement, not a photograph.
03 · ON THE ENGINEER'S LAPTOP
The pattern, and what drove it.
Classifier: macro-F1 0.92 on 9,357 held-out WM-811K maps. Etch trace: real LAM 9600 data, 21/21 faults caught at 1.3% false alarms.
04 · YIELDGUARD
It explains the failure, and checks itself.
Every sensor, value and past case a hypothesis cites is matched against the tool results behind it. A claim no tool produced is shown in red, never passed off as evidence.